$Intel(INTC)$ Intel CEO Lip-Bu-To The Moon - Tiger Brokers Online Investing Community - To The Moon

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08-17 09:07

$Intel(INTC)$ Intel CEO Lip-Bu Tan recently called new memory architectures his "pet project" on a Tom's Hardware podcast. He described the memory sector as a strategic opportunity within an AI-dominated semiconductor landscape, pointing to a memory shortage extending through 2027. Tan reportedly told major memory suppliers there would be "no relief until 2028" on the supply crunch.

Intel has positioned itself as a strong partner for HBM integration, taking memory made by others like SK Hynix, Samsung, and Micron, and packaging it more tightly with Intel customer chips.

Former SK Hynix CEO Seok-Hee Lee joined Intel as Executive Vice President on June 18 2026. His official mandate covers advanced packaging, system integration, and backend manufacturing, specifically aimed at scaling EMIB-T and HBI to high volume. These are Intel's technologies for physically integrating different chiplets into one package, rather than producing DRAM memory itself. Higher highs look like they could be coming.

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{"i18n":{"language":"en_US"},"data":{"magic":2,"id":597745038411264,"tweetId":"597745038411264","gmtCreate":1786928846000,"gmtModify":1786978500994,"author":{"id":9000000000000183,"idStr":"9000000000000183","authorId":9000000000000183,"authorIdStr":"9000000000000183","name":"tinkie","avatar":"https://static.tigerbbs.com/ba8aa4cb116251d941ecb460f20f465b","vip":8,"userType":8,"introduction":"","boolIsFan":false,"boolIsHead":false,"crmLevel":1,"crmLevelSwitch":0,"individualDisplayBadges":[],"wearingBadges":[],"fanSize":189,"starInvestorFlag":false},"themes":[],"images":[],"coverImages":[],"title":"","html":"<html><head></head><body><p><a href=\"https://ttm.financial/S/INTC\">$Intel(INTC)$&nbsp;</a><v-v data-views=\"1\"></v-v>&nbsp;Intel CEO Lip-Bu Tan recently called new memory architectures his \"pet project\" on a Tom's Hardware podcast. He described the memory sector as a strategic opportunity within an AI-dominated semiconductor landscape, pointing to a memory shortage extending through 2027. Tan reportedly told major memory suppliers there would be \"no relief until 2028\" on the supply crunch.</p>\n<p>Intel has positioned itself as a strong partner for HBM integration, taking memory made by others like SK Hynix, Samsung, and Micron, and packaging it more tightly with Intel customer chips.</p>\n<p>Former SK Hynix CEO Seok-Hee Lee joined Intel as Executive Vice President on June 18 2026. His official mandate covers advanced packaging, system integration, and backend manufacturing, specifically aimed at scaling EMIB-T and HBI to high volume. These are Intel's technologies for physically integrating different chiplets into one package, rather than producing DRAM memory itself. Higher highs look like they could be coming.</p></body></html>","htmlText":"<html><head></head><body><p><a href=\"https://ttm.financial/S/INTC\">$Intel(INTC)$&nbsp;</a><v-v data-views=\"1\"></v-v>&nbsp;Intel CEO Lip-Bu Tan recently called new memory architectures his \"pet project\" on a Tom's Hardware podcast. He described the memory sector as a strategic opportunity within an AI-dominated semiconductor landscape, pointing to a memory shortage extending through 2027. Tan reportedly told major memory suppliers there would be \"no relief until 2028\" on the supply crunch.</p>\n<p>Intel has positioned itself as a strong partner for HBM integration, taking memory made by others like SK Hynix, Samsung, and Micron, and packaging it more tightly with Intel customer chips.</p>\n<p>Former SK Hynix CEO Seok-Hee Lee joined Intel as Executive Vice President on June 18 2026. His official mandate covers advanced packaging, system integration, and backend manufacturing, specifically aimed at scaling EMIB-T and HBI to high volume. These are Intel's technologies for physically integrating different chiplets into one package, rather than producing DRAM memory itself. Higher highs look like they could be coming.</p></body></html>","text":"$Intel(INTC)$ Intel CEO Lip-Bu Tan recently called new memory architectures his \"pet project\" on a Tom's Hardware podcast. He described the memory sector as a strategic opportunity within an AI-dominated semiconductor landscape, pointing to a memory shortage extending through 2027. Tan reportedly told major memory suppliers there would be \"no relief until 2028\" on the supply crunch. Intel has positioned itself as a strong partner for HBM integration, taking memory made by others like SK Hynix, Samsung, and Micron, and packaging it more tightly with Intel customer chips. Former SK Hynix CEO Seok-Hee Lee joined Intel as Executive Vice President on June 18 2026. His official mandate covers advanced packaging, system integration, and backend manufacturing, specifically aimed at scaling EMIB-T and HBI to high volume. These are Intel's technologies for physically integrating different chiplets into one package, rather than producing DRAM memory itself. Higher highs look like they could be coming.","highlighted":1,"essential":1,"paper":1,"likeSize":0,"commentSize":0,"repostSize":0,"favoriteSize":0,"link":"https://ttm.financial/post/597745038411264","repostId":0,"isVote":1,"tweetType":1,"viewCount":15,"commentLimit":10,"likeStatus":false,"favoriteStatus":false,"reportStatus":false,"symbols":["INTC"],"verified":2,"subType":0,"readableState":1,"langContent":"EN","currentLanguage":"EN","warmUpFlag":false,"orderFlag":false,"shareable":true,"causeOfNotShareable":"","featuresForAnalytics":[],"commentAndTweetFlag":false,"andRepostAutoSelectedFlag":false,"upFlag":false,"length":855,"optionInvolvedFlag":false,"subscribersOnly":false,"subscribersOnlyAccessible":false,"xxTargetLangEnum":"ORIG"},"commentList":[],"hasMoreComment":false,"orderType":2}